PCB Redesign and Development - ON-971

Genre de projet: Innovation
Discipline(s) souhaitée(s): Génie - informatique / électrique, Génie
Entreprise: Airshare
Durée du projet: 4 à 6 mois
Date souhaitée de début: Dès que possible
Langue exigée: Anglais
Emplacement(s): Ottawa, ON, Canada
Nombre de postes: 1
Niveau de scolarité désiré: CollègeÉtudes de premier cycle/baccalauréat
Ouvert aux candidatures de personnes inscrites à un établissement à l’extérieur du Canada: Yes

Au sujet de l’entreprise: 

For anyone facing threats from wayward or malicious drones, AirShare makes the World’s Friendliest Missile to safely and cost-effectively mitigate those threats.

Veuillez décrire le projet.: 

AirShare has developed a line of low-cost, 3d printed missiles for the counter-drone industry.  The company has broken through several barriers in creating low cost guided and ballistic missiles using low-cost commercial off-the-shelf components.  The company is embarking on another world’s first in creating a 6th generation system which attempts to exceed Mach 1.0 and reach ranges of up to 4km.  The candidates will work on advanced flight computer algorithms and sensors, as well as airframe design using advanced additive manufacturing techniques.

Airshare is currently redesigning its rocket technology. This requires a corresponding change to the shape of the existing printed circuit board. The existing design must be modified to fit the new shape.

Expertise ou compétences exigées: 

PCB design, schematic capture, knwoledge of layout tools high-speed design and routing knowledge. Electrical isolation techniques, noise suppression